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HW20-M2 50 High Tg, Low X, Y\/Z Coefficient of Thermal Expansion White Material ◆優(yōu)異的耐CAF性能 Excellent CAF resistance ◆低X、Y\/Z軸熱膨脹系數(shù)高Tg(210℃,DMA）Low X,Y\/Z axis thermal expansion coefficient High Tg(210℃,DMA) ◆白色類BT樹脂物材料 White BT resin material 產(chǎn)品特性 FEATURES ◆集成電路組件 Integrated circuit components ◆芯片LED基板 Chip LED substrate ◆Mini LED Mini LED 產(chǎn)品應(yīng)用 APPLICATIONS ◆Specimen thickness: 0.8mmSpecification sheet: 試樣厚度：0.8mm IPC-4101E\/126 is for your reference only 規(guī)格表：IPC-4101E\/126僅供參考 產(chǎn)品性能GENERAL PROPERTIES V-0 0.03 210 390 ＞60 ＞60 10S\/6 Cycles pass 30 180 2.2 13-15 5-10 0.7 ＜0.3 45KV\/mm 5.8 0.02 ≥1.05N\/mm(1oz) ≥1.05N\/mm(1 oz) - mm ℃ ℃ min min - PPM\/℃ PPM\/℃ % PPM\/℃ PPM\/℃ W\/(m·k） % KV - - UL-94 UL DMA 5% Weight Loss TMA TMA 288℃, Solder dip Before Tg After Tg 50-260℃ Before Tg After Tg ASTM D5470 D-24\/23 D-48\/50+D-0.5\/23 @1GHz @1GHz A 288℃\/10S 耐燃性-Flammability 絕緣層最小厚度\/Minimum thickness 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱分解溫度-TD 耐熱性-T260 耐熱性-T288 熱應(yīng)力-Thermal Stress 導(dǎo)熱系數(shù)Thermal conductivity 吸水率-Water Absorption 擊穿電壓-Dielectric Breakdown 介電常數(shù)-Permittivity 損耗因子-Loss Tangent 彎曲強(qiáng)度-Flexural Strength 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity A E-24\/125 E-24\/125 LW CW Mpa MΩ-cm MΩ Gpa Gpa 480\/480 ≥103 ≥103 熱膨脹系數(shù)-CTE (Z-axis) 熱膨脹系數(shù)-CTEX\/Y-axis CTE 剝離強(qiáng)度-Peel Strength 彈性模數(shù)Modulus of elasticity 23 N\/mm 項(xiàng)目 Item 檢測方法 IPC-TM-650 單位 Unit 典型值 Typical value

High Tg, Low X,Y\/Z-axis CTE Black Colored BT Laminate for Chip LED Substrates and IC Package HB20-M1 51 ◆Lead-free compatible Halogen free material. ◆BT like resin material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (230℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity ◆Excellent in index and Color consistency FEATURES GENERAL PROPERTIES ◆Mini&Micro LED ◆Mini &Micro display (HDI) ◆Mini RGB PKG (1010, F1010, etc) ◆IC Package ◆Memory ◆MEMS ◆CSP APPLICATIONS Test item Test condition Unit HB20-M1 UL號\/UL No. - UL DMA TMA After Tg 50-260℃ Before Tg After Tg D-24\/23 A 288℃\/10s @10GHz @10GHz E-24\/125 A LW CW - E136069 mm ℃ min PPM\/℃ % PPM\/℃ PPM\/℃ % N\/mm - - MΩ Mpa Gpa Gpa Flammability UL-94 - V-0 0.03 ≥230 ＜150 Before Tg PPM\/℃ ＜25 <2.0 11-13 5-10 <0.35 ≥0.8（TOZ） ≥0.8（TOZ） 4.3 0.010 ≥103 480\/480 28 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ＞390 T288 Thermal Stress 288℃ solder dip - 6 cycles pass Z-axis CTE X\/Y-axis CTE Moisture Absorption Dielectric Breakdown D-48\/50+D-0.5\/23 KV 45KV\/mm Thermal conductivity ASTM D5470 W\/(m ·K) 0.5 Peel Strength Dielectric constant Dissipation Factor Surface resistivity Volume Resistivity E-24\/125 MΩ.cm ≥103 Bending strength(LW\/CW) Young's modulus ＞60

High Tg, Low X,Y\/Z-axis CTE Black Colored BT Laminate for Chip LED Substrates and IC Package HB20-M2 52 ◆Lead-free compatible Halogen free material. ◆BT like resin material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (220℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity ◆Excellent in index and Color consistency FEATURES GENERAL PROPERTIES ◆Mini&Micro LED ◆Mini &Micro display (HDI) ◆Mini RGB PKG (1010, F1010, etc) ◆IC Package ◆Memory ◆MEMS ◆CSP APPLICATIONS Test item Test condition Unit HB20-M2 UL No. - UL DMA TMA Before Tg 50-260℃ Before Tg D-24\/23 A 288℃\/10s @1GHz @1GHz E-24\/125 A LW CW - E136069 mm ℃ min PPM\/℃ % PPM\/℃ % N\/mm - - Ω Mpa Gpa Gpa UL燃燒等級\/Flammability UL-94 - V-0 0.03 220 25 2.0 After Tg PPM\/℃ 150 12-14 After Tg PPM\/℃ 5-10 ＜0.3 ≥0.6N\/mm（TOZ） ≥0.6N\/mm（TOZ） 4.5 0.012 ≥103 480\/480 25 絕緣層最小厚度 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ 390 T288 TMA min ＞60 T260 Thermal Stress 288℃ solder dip - 6 cycles pass Z-axis CTE X\/Y-axis CTE 吸水率\/Moisture Absorption 絕緣強(qiáng)度\/Dielectric Breakdown D-48\/50+D-0.5\/23 KV 45KV\/mm Thermal conductivity ASTM D5470 W\/(m ·K) 0.5 剝離強(qiáng)度\/Peel Strength 介電常數(shù)\/Dielectric constant Dissipation Factor 表面電阻\/Surface resistivity 體積電阻率\/Volume Resistivity E-24\/125 Ω-cm ≥103 Bending strength(LW\/CW) 彎曲模量\/Bending modulus

High Tg, Halogen Free, Low X,Y\/Z-axis CTE Black Colored BT Laminate for IC Package HI10L 53 ◆Lead-free compatible Halogen free material. ◆BT like resin material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (260℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity ◆Excellent in index and Color consistency FEATURES GENERAL PROPERTIES ◆IC Package ◆RF ◆Memory ◆MEMS ◆BTC ◆PMIC ◆Module ◆Mini&Micro LED ◆Mini &Micro display (HDI) ◆Mini RGB PKG (1010, F1010, etc) APPLICATIONS Test item Test condition Unit HI10L UL號\/UL No. - UL DMA TMA After Tg 50-260℃ Before Tg After Tg D-24\/23 A 288℃\/10s @10GHz @10GHz E-24\/125 A LW CW - E136069 mm ℃ min PPM\/℃ % PPM\/℃ PPM\/℃ % N\/mm - - MΩ Mpa Gpa Gpa UL燃燒等級\/Flammability UL-94 - V-0 0.03 ≥260 ＜125 Before Tg PPM\/℃ ＜25 <1.0 9-11 1-4 <0.35 ≥0.8（TOZ） ≥0.8（TOZ） 4.3 0.008 ≥106 490\/510 28 絕緣層最小厚度 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ＞400 T288 Thermal Stress 288℃ solder dip - Pass Z-axis CTE X\/Y-axis CTE 吸水率\/Moisture Absorption 絕緣強(qiáng)度\/Dielectric Breakdown D-48\/50+D-0.5\/23 KV 45 Thermal conductivity ASTM D5470 W\/(m ·K) 0.5 剝離強(qiáng)度\/Peel Strength 介電常數(shù)\/Dielectric constant Dissipation Factor 表面電阻\/Surface resistivity 體積電阻率\/Volume Resistivity E-24\/125 MΩ.cm ≥104 抗彎強(qiáng)度\/Bending strength (LW\/CW) 彎曲模量\/Bending modulus ≥60

High Tg, Halogen Free, Low X,Y\/Z-axis CTE BT Laminate for Chip LED Substrates and IC Package HI07L 54 ◆Lead-free compatible Halogen free material. ◆BT like resin material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (≥300℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity FEATURES GENERAL PROPERTIES ◆FC BGA ◆CPU & GPU ◆FPGA 、ASIC ◆IC Package ◆RF Switch ◆Low Noise Amplifier(LNA) ◆Power Amplifier(PA) APPLICATIONS Test item Test condition Unit HI07L UL No. - UL DMA TMA Before Tg After Tg 50-260℃ Pull Compression D-24\/23 A 288℃\/10s @10GHz @10GHz E-24\/125 E-24\/125 LW CW - mm ℃ min PPM\/℃ PPM\/℃ % PPM\/℃ PPM\/℃ % N\/mm - - MΩ MΩ.cm Gpa Gpa UL Flammability UL-94 - V-0 0.03 ≥300 ＞60 ＜25 <100 <1.2 7-9 10-12 ≤0.4 ≥0.8 ≥0.8 4.4 0.008 >1X108 >1X107 32 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ＞400 T288 Thermal Stress 288℃ solder dip - Pass Z-axis CTE X\/Y-axis CTE Moisture Absorption Peel Strength Dielectric constant Dissipation Factor Surface resistivity Volume Resistivity Bending modulus

High Tg, Halogen Free, LOW DK GLASS,Low X,Y\/Z-axis CTE BT Laminate for 5G RF and Antenna module HI10L FK 55 ◆Lead-free compatible Halogen free material. ◆BT based material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (270℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity ◆Excellent in Dk and Df FEATURES GENERAL PROPERTIES ◆IC Substrate（5G RF） ◆IC Substrate（5G Aip） ◆IC Substrate（CPU\/GPU） ◆Optical module APPLICATIONS Test item Test condition Unit HI10L FK UL號\/UL No. - UL DMA TMA Before Tg After Tg Before Tg After Tg D-24\/23 A 288℃\/10s @1GHz @1GHz C-96\/20\/65 A LW CW - - mm ℃ min PPM\/℃ PPM\/℃ PPM\/℃ PPM\/℃ % N\/mm - - Ω Mpa Gpa Gpa UL燃燒等級\/Flammability UL-94 - V-0 0.03 ＞260 ＜30 100-150 ＜11 2-5 ＜0.35 ≥0.7 ≥0.7 3.4 ＜0.003 1X106 370 25 絕緣層最小厚度 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ＞400 T288 TMA min ＞60 T260 Thermal Stress 288℃ solder dip - Pass Z-axis CTE X\/Y-axis CTE 吸水率\/Moisture Absorption Thermal conductivity ASTM D5470 W\/(m ·K) 0.5 剝離強(qiáng)度\/Peel Strength 介電常數(shù)\/Dielectric constant Dissipation Factor 表面電阻\/Surface resistivity 體積電阻率\/Volume Resistivity C-96\/20\/65 Ω-cm 1X106 抗彎強(qiáng)度\/Bending strength (LW\/CW) 楊氏模量\/Young's modulus

High Tg, Halogen Free, Low X,Y\/Z-axis CTE BT Laminate for Chip LED Substrates and IC Package HI07L T 56 ◆Lead-free compatible Halogen free material. ◆BT like resin material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (≥300℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity FEATURES GENERAL PROPERTIES ◆FC BGA ◆CPU & GPU ◆FPGA 、ASIC ◆IC Package ◆RF Switch ◆Low Noise Amplifier(LNA) ◆Power Amplifier(PA) APPLICATIONS Test item Test condition Unit HI07L T UL Flammability UL-94 UL DMA TMA Before Tg After Tg 50-260℃ Pull Compression D-24\/23 A 288℃\/10s @10GHz @10GHz E-24\/125 E-24\/125 LW CW - mm ℃ min PPM\/℃ PPM\/℃ % PPM\/℃ PPM\/℃ % N\/mm - - MΩ MΩ.cm Gpa Gpa V-0 - ≥290 ≥60 18 80 0.6 4-7 7-10 ≤0.4 ≥0.8 ≥0.8 4.3±0.2 <0.01 >1X108 >1X107 32 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ≥400 T288 Thermal Stress 288℃ solder dip - Pass Z-axis CTE X\/Y-axis CTE Moisture Absorption Peel Strength Dielectric constant Dissipation Factor Surface resistivity Volume Resistivity Bending modulus

High Tg, Halogen Free, Low X,Y\/Z-axis CTE Black Colored BT Laminate for IC Package HI10L K 57 ◆Lead-free compatible Halogen free material. ◆BT like resin material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (260℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity ◆Excellent in index and Color consistency FEATURES GENERAL PROPERTIES ◆IC Package ◆Memory ◆MEMS ◆CSP ◆Mini&Micro LED ◆Mini &Micro display (HDI) ◆Mini RGB PKG (1010, F1010, etc) APPLICATIONS Test item Test condition Unit HI10L K UL號\/UL No. - UL DMA TMA After Tg 50-260℃ Before Tg After Tg D-24\/23 A 288℃\/10s @10GHz @10GHz E-24\/125 A LW CW - E136069 mm ℃ min PPM\/℃ % PPM\/℃ PPM\/℃ % N\/mm - - MΩ Mpa Gpa Gpa UL燃燒等級\/Flammability UL-94 - V-0 0.03 ≥260 ＜125 Before Tg PPM\/℃ ＜25 <1.0 9-11 1-4 ＜0.3 ≥0.8（TOZ） ≥0.8（TOZ） 3.4 0.008 ≥106 450\/510 28 絕緣層最小厚度 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ＞400 T288 Thermal Stress 288℃ solder dip - Pass Z-axis CTE X\/Y-axis CTE 吸水率\/Moisture Absorption 絕緣強(qiáng)度\/Dielectric Breakdown D-48\/50+D-0.5\/23 KV 45 Thermal conductivity ASTM D5470 W\/(m ·K) 0.5 剝離強(qiáng)度\/Peel Strength 介電常數(shù)\/Dielectric constant Dissipation Factor 表面電阻\/Surface resistivity 體積電阻率\/Volume Resistivity E-24\/125 MΩ.cm ≥104 抗彎強(qiáng)度\/Bending strength (LW\/CW) 彎曲模量\/Bending modulus ≥60

High Tg, Halogen Free, Low X,Y\/Z-axis CTE Black Colored BT Laminate for IC Package HI10L T 58 ◆Lead-free compatible Halogen free material. ◆BT like resin material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (260℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity ◆Excellent in index and Color consistency FEATURES GENERAL PROPERTIES ◆IC Package ◆Memory ◆MEMS ◆CSP ◆Mini&Micro LED ◆Mini &Micro display (HDI) ◆Mini RGB PKG (1010, F1010, etc) APPLICATIONS Test item Test condition Unit HI10L T UL號\/UL No. - UL DMA TMA After Tg 50-260℃ Before Tg After Tg D-24\/23 A 288℃\/10s @10GHz @10GHz E-24\/125 A LW CW - mm ℃ min PPM\/℃ % PPM\/℃ PPM\/℃ % N\/mm - - MΩ Mpa Gpa Gpa UL燃燒等級\/Flammability UL-94 - V-0 0.03 ≥260 ＜125 Before Tg PPM\/℃ ＜25 <1.0 7-9 1-4 <0.35 ≥0.8（TOZ） ≥0.8（TOZ） 4.0 0.008 ≥106 490\/520 28 絕緣層最小厚度 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ＞400 T288 Thermal Stress 288℃ solder dip - Pass Z-axis CTE X\/Y-axis CTE 吸水率\/Moisture Absorption 絕緣強(qiáng)度\/Dielectric Breakdown D-48\/50+D-0.5\/23 KV 45 Thermal conductivity ASTM D5470 W\/(m ·K) 0.5 剝離強(qiáng)度\/Peel Strength 介電常數(shù)\/Dielectric constant Dissipation Factor 表面電阻\/Surface resistivity 體積電阻率\/Volume Resistivity E-24\/125 MΩ.cm ≥104 抗彎強(qiáng)度\/Bending strength (LW\/CW) 彎曲模量\/Bending modulus ≥60

High Tg, Halogen Free, Low X,Y\/Z-axis CTE Black Colored BT Laminate for IC Package HI05L T 59 ◆Lead-free compatible Halogen free material. ◆BT based material ◆Lower X,Y\/Z-axis CTE ◆High glass transition temperature, High heat resistance (280℃,DMA) ◆Keeping high modulus in high temperature ◆Good punching & Drilling ability ◆Excellent Anti-CAF resistance ◆Excellent in Thickness Uniformity FEATURES GENERAL PROPERTIES ◆FC CSP ◆CPU & GPU ◆FPGA 、ASIC ◆IC Package ◆RF Switch ◆Low Noise Amplifier(LNA) ◆Power Amplifier(PA) APPLICATIONS Test item Test condition Unit HI05L T UL號\/UL No. - UL DMA TMA Before Tg After Tg Pull Compression D-24\/23 A 288℃\/10s @10GHz @10GHz E-24\/125 LW CW - mm ℃ min PPM\/℃ PPM\/℃ PPM\/℃ PPM\/℃ % N\/mm - - MΩ Gpa Gpa UL燃燒等級\/Flammability UL-94 - V-0 0.025 ≥280 10-30 20-60 3-5 <10 ≤0.3 ≥0.8 ≥0.8 4.0±0.3 ＜0.008 >1X108 ≥26 絕緣層最小厚度 Minimum thickness Tg Td(5%loss) 10℃\/min@N_2 ℃ ≥400 T288 ≥30 Thermal Stress 288℃ solder dip - Pass Z-axis CTE X\/Y-axis CTE 吸水率\/Moisture Absorption 剝離強(qiáng)度\/Peel Strength 介電常數(shù)\/Dielectric constant 介電損耗\/Dissipation Factor 表面電阻\/Surface resistivity 體積電阻\/Volume Resistivity E-24\/125 MΩ.cm >1X107 楊氏模量\/Young's modulus LW CW Gpa Gpa 彎曲模量\/Bending modulus ≥30

CBF-018 ◆Lead-free ◆High Tg ◆Low Ra ◆High thickness uniformity ◆High roundness of laser drilling ◆Excellent capacity of SAP ◆High peel strength for fine-lines FEATURES Two-stage vacuum hot-press machine Device： 1. Before hot-pressing，remove the inner BOPP protect film 2. Vacuum stage, 100℃ + 5 kgf + vacuum 30s, pressing 60s 3. Leveling stage, 100℃+5kgf+leveling 60s Recommended process conditions： APPLICATIONS RECOMMENDED HOT-PRESSING PROCESS STANDARD SIZE STRUCTURES 60 High Tg, Low Ra, High peel strength Crebest Build-up Film for IC Substrates Standard size Wideness 506mm, coiled shape 25 μm 30 μm 35 μm 40 μm Typical thickness CBF is suitable for processing package substrates with fine-line circuits by SAP (Semi-Additive PCB Process). CBF as advanced packaging materials, can be used in FCBGA, FCCSP, Embedding, etc.. Release film CBF-018 Protect film

CBF-018 GENERAL PROPERTIES PERFORMANCE TEST DATA 61 High Tg, Low Ra, High peel strength Crebest Build-up Film for IC Substrates DMA—Tg DMA—R.T. tensile test Property Normal thickness Curing condition Min.Melting temperature Min.Melting viscosity Td@N2 Tg(DMA) Tg(Tensile TMA) CTE x-y (30-150℃) CTE x-y (150-240℃) Young’s Modulus Tensile Strength Elongation Dk (5 GHz\/10GHz) Df (5 GHz\/10GHz) Test Method Typical Value - - Dynamic Rheometer (Anton Paar MCR302) TGA (HT DSC HSS2) 25\/30\/35\/40\/90 μm Half-curing 100℃@30 min 170℃@30 min 100℃@30 min 180℃@90 min Post-curing Tensile Model (TA DMA Q800) Tensile Model (NETZSCH TMA 402 F1) Tensile Model (TMA, NETZSCH TMA 402 F1) Tensile Model (TA DMA Q800) SPDR (Keysight E5071C ENA) 113℃ 26 Pa·s 385℃ 180℃ 160℃ 37 ppm\/K 120 ppm\/K 6.0 GPa 94 MPa 5.0% 3.32\/3.39 0.018\/0.018

CBF-018 TGA——Td95% TMA——CTE Desmear performance Peel strength (with Cu) 62 High Tg, Low Ra, High peel strength Crebest Build-up Film for IC Substrates Remark: ◆Any specific requirement could be available upon request. ◆The above data are for your reference only. ◆If need more information, please contact Shenzhen CREBEST Electronic Materials Co., Ltd through Jack Zhang at 15919232997\/jida.zhang@hzccl.com. SPDR——Dk\/Df Number Freq(MHz) Dk Df Number Freq(MHz) Dk Df 0.018 0.018 0.018 0.018 0.018 0.018 0.018 0.018 0.018 0.018 0.018 0.018 3.34 3.28 3.36 3.33 3.31 3.32 3.39 3.41 3.35 3.38 3.42 3.39 1 2 3 4 5 Ave. 1 2 3 4 5 Ave. 5 GHz 10 GHz

CBF-013 ◆Lead-free ◆Mid-CTE ◆High Tg ◆Low Ra ◆High thickness uniformity ◆High roundness of laser drilling ◆Excellent capacity of SAP ◆High peel strength for fine-lines FEATURES Two-stage vacuum press machine Device： 1. Before hot-pressing，remove the inner BOPP protect film 2. Vacuum stage, 100℃ + 5 kgf + vacuum 30s, pressing 60s 3. Leveling stage, 100℃ + 5 kgf + leveling 60s Recommended process conditions： APPLICATIONS RECOMMENDED HOT-PRESSING PROCESS STANDARD SIZE STRUCTURES 63 Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC Substrates Standard size Wideness 506mm, coiled shape 25 μm 30 μm 35 μm 40 μm Typical thickness CBF is suitable for processing package substrates with fine-line circuits by SAP (Semi-Additive PCB Process). CBF as advanced packaging materials, can be used in FCBGA, FCCSP, Embedding, etc.. Release film CBF-013 Protect film

CBF-013 GENERAL PROPERTIES PERFORMANCE TEST DATA 64 Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC Substrates DMA—Tg DMA—R.T. tensile test Property Normal thickness Curing condition Min.Melting temperature Min.Melting viscosity Td@N2 Tg(DMA) Tg(Tensile TMA) CTE x-y (30-150℃) CTE x-y (150-240℃) Young’s Modulus Tensile Strength Elongation Dk (5 GHz\/10GHz) Df (5 GHz\/10GHz) Test Method Typical Value - - Dynamic Rheometer (Anton Paar MCR302) TGA (HT DSC HSS2) 25\/30\/35\/40\/ μm Half-curing 100℃@30 min 180℃@30 min 100℃@30 min 180℃@90 min Post-curing Tensile Model (TA DMA Q800) Tensile Model (NETZSCH TMA 402 F1) Tensile Model (TMA, NETZSCH TMA 402 F1) Tensile Model (TA DMA Q800) SPDR (Keysight E5071C ENA) 100℃ 14 Pa·s 385℃ 175℃ 160℃ 29 ppm\/K 110 ppm\/K 9.0 GPa 107 MPa 3% 3.35\/3.35 0.015\/0.015 CBF-013

CBF-013 TGA——Td95% TMA——CTE Desmear performance SPDR——Dk\/Df Peel strength (with Cu) 65 Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC Substrates Number Freq(MHz) Dk Df 10 GHz Number Freq(MHz) Dk Df 1 2 3 4 5 Ave. 1 2 3 4 5 Ave. 3.32 3.37 3.37 3.35 3.33 3.35 3.35 3.37 3.35 3.34 3.34 3.35 0.015 0.015 0.015 0.015 0.015 0.015 0.015 0.015 0.015 0.015 0.015 0.015 5 GHz Remark: ◆Any specific requirement could be available upon request. ◆The above data are for your reference only. ◆If need more information, please contact Shenzhen CREBEST Electronic Materials Co., Ltd through Jack Zhang at 15919232997\/jida.zhang@hzccl.com.

CBF-014A ◆Lead-free ◆Mid-CTE ◆High Tg ◆Low Ra ◆Good thickness uniformity ◆High roundness of laser drilling ◆Excellent capacity of SAP ◆High peel strength for fine-lines FEATURES Two-stage vacuum press machine Equipment： 1. Before hot-pressing，remove the inner BOPP protect film 2. Vacuum stage, 105℃+5kgf+vacuum 60s 3. Leveling stage, 105℃+5kgf+leveling 60s Recommended process conditions： APPLICATIONS RECOMMENDED HOT-PRESSING PROCESS STANDARD SIZE STRUCTURES 66 Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC Substrates Standard size Wideness 506mm, coiled shape 25 μm 30 μm 35 μm 40 μm 90 μm Typical thickness CBF is suitable for processing package substrates with fine-line circuits by SAP (Semi-Additive PCB Process). CBF as advanced packaging materials, can be used in FCBGA, FCCSP, Embedding, etc. Release film CBF-014A Protect film

CBF-014A GENERAL PROPERTIES PERFORMANCE TEST DATA 67 Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC Substrates DMA—Tg DMA—R.T. tensile test Property Normal thickness Curing condition Min.Melting temperature Min.Melting viscosity Td@N2 Tg(DMA) Tg(Tensile TMA) CTE x-y (30-150℃) CTE x-y (150-240℃) Thermal conductivity Young’s Modulus Tensile Strength Elongation Dk (5 GHz\/10GHz) Df (5 GHz\/10GHz) Test Method Typical Value - - Dynamic Rheometer (Anton Paar MCR302) TGA (HT DSC HSS2) Water absorption - < 0.5% 388℃ 175℃ 165℃ 29 ppm\/K 110 ppm\/K 25\/30\/35\/40\/90 μm Half-curing 100℃@30 min 180℃@30 min 100℃@30 min 180℃@60 min Post-curing Tensile Model (TA DMA Q800) Tensile Model (NETZSCH TMA 402 F1) ASTM D5470-17 (Longwin, LW9389 TIM) 0.5 W\/(mK) Flame retardant UL 94V standard V0 7.5 GPa 84 MPa 3.1% Tensile Model (TMA, NETZSCH TMA 402 F1) Tensile Model (TA DMA Q800) SPDR (Keysight E5071C ENA) Breakdown strength (DC\/AC) programmable withstanding voltage tester (CS9917CX, Allwin Instrument) 105℃ 37.5 μm, ~10 kV\/ ~7 kV 3.28\/3.28 0.012\/0.012 21 Pa·s

CBF-014A TGA——Td95% TMA——CTE Desmear performance Breakdown strength SPDR——Dk\/Df Peel strength (with Cu) 68 Mid-CTE, Low Ra, High peel strength Crebest Build-up Film for IC Substrates Number Freq(MHz) Dk Df Number Freq(MHz) Dk Df 0.012 0.012 0.012 0.012 0.012 0.012 0.012 0.012 0.012 0.012 0.012 0.012 3.26 3.29 3.27 3.30 3.27 3.28 3.22 3.23 3.32 3.33 3.32 3.28 1 2 3 4 5 Ave. 1 2 3 4 5 Ave. 5 GHz 10 GHz Remark: ◆Any specific require could be available upon request. ◆The above data is for your reference only. ◆If need more information, please contact Shenzhen CREBEST Electronic Materials Co. Ltd (深圳中科華正半導(dǎo)體材料有限公司) through Jack Zhang at 15919232997\/jida.zhang@hzc cl.com.

CBF-004 ◆Lead-free ◆Low CTE ◆High Tg ◆Low Ra ◆Low dielectric loss ◆High roundness of laser drilling ◆Excellent capacity of SAP ◆High peel strength for fine-lines FEATURES Two-stage vacuum press machine Device： 1. Before hot-pressing，remove the inner BOPP protect film 2. Vacuum stage, 100℃ + 5 kgf + vacuum 30s, pressing 60s 3. Leveling stage, 100℃ + 5 kgf + leveling 60s Recommended process conditions： APPLICATIONS RECOMMENDED HOT-PRESSING PROCESS STANDARD SIZE STRUCTURES 69 Low CTE, Low Df, low Ra Crebest Build-up Film for IC Substrates Standard size Wideness 506mm, coiled shape 25 μm 30 μm 35 μm 90 μm Thickness CBF is suitable for processing package substrates with fine-line circuits by SAP (Semi-Additive PCB Process). CBF as advanced packaging materials, can be used in FCBGA, FCCSP, Embedding, etc.. Release film CBF-004 Protect film

CBF-004 GENERAL PROPERTIES PERFORMANCE TEST DATA 70 DMA—Tg DMA—R.T. tensile test Property Normal thickness Curing condition Min.Melting temperature Min.Melting viscosity Td@N2 Tg(DMA) Tg(Tensile TMA) CTE x-y (30-150℃) CTE x-y (150-240℃) Young’s Modulus Tensile Strength Elongation Dk (5 GHz\/10GHz) Df (5 GHz\/10GHz) Test Method CBF-004 - - Dynamic Rheometer (Anton Paar MCR302) TGA (HT DSC HSS2) 25\/30\/35\/40\/90 μm Semi-curing 130℃@30 min 180℃@30 min 130℃@30 min 190℃@90 min Post-curing Tensile Model (TA DMA Q800) Tensile Model (NETZSCH TMA 402 F1) Tensile Model (TMA, NETZSCH TMA 402 F1) Tensile Model (TA DMA Q800) SPDR (Keysight E5071C ENA) 130℃ 200 Pa·s 390℃ 180℃ 160℃ 20 ppm\/K 80 ppm\/K 12 GPa 90 MPa 1.5% 3.3\/3.4 0.0045\/0.0045 Low CTE, Low Df, low Ra Crebest Build-up Film for IC Substrates

CBF-004 TGA——Td95% TMA——CTE Desmear performance SPDR——Dk\/Df Peel strength (with Cu) 71 Number Freq(MHz) Thickness(mm) Dk Df 0.005376 0.005103 0.005028 0.005118 0.005171 0.0052 3.216034 3.347095 3.225112 3.276175 3.272771 3.27 1 2 3 4 5 Ave. 0.035 0.035 0.035 0.035 0.035 0.035 5 GHz Remark: ◆Any specific require could be available upon request. ◆The above data is for your reference only. ◆Please contact Shenzhen CREBEST Electronic Materials Co., Ltd if need more Lami- nates. Low CTE, Low Df, low Ra Crebest Build-up Film for IC Substrates

H175HF FR-4.1 High Tg, Halogen Free & Mid Loss Material ◆耐CAF能力 CAF resistance performance ◆符合Mid-loss材料插損需求 Suitable for Mid-loss insertion requirements ◆優(yōu)良的可靠性 Excellent Reliability 產(chǎn)品特性 FEATURES ◆服務(wù)器、交換機(jī)、基站、電腦周邊設(shè)備 Server, Switch, Base station, Computer peripherals 產(chǎn)品應(yīng)用 APPLICATIONS 72 產(chǎn)品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ 175 168 205 34 193 2.1 \/ 4.70*1010 3.54*10 8 130 60 - 550 450 0.12 385 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 4.42 SPDR method 10GHz C-24\/23\/50 4.30 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 18-20 N\/mm 0.85 1.15 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC50%) 介質(zhì)損耗 Df-Loss Tangent (RC50%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0105 SPDR method 10GHz C-24\/23\/50 0.0120 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

H175HFZ FR-4.1 Halogen-free, High Reliability& Mid Loss Material ◆耐CAF能力 CAF resistance performance ◆符合Mid-loss材料插損需求 Suitable for Mid- loss insertion requirements ◆優(yōu)良的可靠性 Excellent Reliability ◆更低的Z軸熱膨脹系數(shù) Lower Z-axis CTE 產(chǎn)品特性 FEATURES ◆服務(wù)器、交換機(jī)、基站、線卡 Server,Switch, Base station ,Line cards ◆厚銅電源 Power supplier and Heavy Copper ◆EV,PEV,HEV,OBC,MDC汽車電子元器件 EV,PEV,HEV,OBC,MDC Automotive electronic components 產(chǎn)品應(yīng)用 APPLICATIONS 73 產(chǎn)品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ 180 184 210 33 194 1.8 \/ 4.70*1010 3.54*10 8 130 60 \/ 550 450 0.10 385 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 4.3 SPDR method 10GHz C-24\/23\/50 4.2 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 12.5 N\/mm 0.85 1.15 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC50%) 介質(zhì)損耗 Df-Loss Tangent (RC50%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0091 SPDR method 10GHz C-24\/23\/50 0.0100 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

H180HF 74 FR-4.1 Halogen Free, Low Loss & High Reliability Material ◆優(yōu)異的耐熱性 Excellent thermal reliability ◆優(yōu)秀的耐CAF性能 Excellent CAF resistance performance ◆較低的Dk\/Df Lower Dk\/Df ◆更低的Z軸熱膨脹系數(shù)、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability 產(chǎn)品特性 FEATURES 產(chǎn)品性能GENERAL PROPERTIES ◆服務(wù)器、交換機(jī)、基站 Server, Switch, Base station ◆背板、線卡 Backplane, Line cards ◆商用路由器 Office Routers 產(chǎn)品應(yīng)用 APPLICATIONS ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ 180 175 210 35 200 2.2 \/ 4.13 4.13*109 2.52*108 65 \/ 630 520 0.12 385 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 4.09 SPDR method 10GHz C-24\/23\/50 3.90 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 12 N\/mm 0.70 1.00 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC50%) 介質(zhì)損耗 Df-Loss Tangent (RC50%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.005 SPDR method 10GHz C-24\/23\/50 0.007 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

H185HFL 75 Low Loss & Low CTE & Halogen Free 產(chǎn)品特性 FEATURES 產(chǎn)品性能GENERAL PROPERTIES 產(chǎn)品應(yīng)用 APPLICATIONS ◆適用于高可靠性、優(yōu)異CAF表現(xiàn)求應(yīng)用場景 For high-reliability and excellent CAF performance applications ◆X\/Y\/Z 三軸低熱膨脹系數(shù)（CTE） Low CTE for X\/ Y\/ Z-axis direction ◆更低的損耗 Low Df for excellent electrical performance ◆符合 RoHS 環(huán)保標(biāo)準(zhǔn) RoHS Compliant ◆汽車及功率能源模Automotive and power energy modules ◆移動設(shè)備 Mobile device ◆高速服務(wù)器 High-speed server ◆網(wǎng)絡(luò)及電信設(shè)備 Network and telecom ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ 190 230 270 26 130 1.25 \/ ＞1010 ＞109 180 30 \/ 24-26 23-26 0.10 430 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 4.0 SPDR method 10GHz C-24\/23\/50 3.90 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >60 2.4.24.5 ＜Tg，TMA ppm\/℃ 10 N\/mm 0.8 1.1 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC50%) 介質(zhì)損耗 Df-Loss Tangent (RC50%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.005 SPDR method 10GHz C-24\/23\/50 0.007 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

H190HF 76 FR4.1 Halogen Free, Very Low Loss & High Reliability Material ◆較低的Dk\/Df Lower Dk\/Df ◆更優(yōu)異的耐熱性 High heat resistance ◆更低的Z軸熱膨脹系數(shù) Lower Z-axis CTE ◆更低的吸水率 Lower moisture absorption 產(chǎn)品特性 FEATURES 產(chǎn)品性能GENERAL PROPERTIES ◆超高速網(wǎng)絡(luò)設(shè)備 High Speed Network equipment ◆服務(wù)器、交換機(jī)、存儲、路由器 Server, Switch, Storage and Routers ◆光通訊產(chǎn)品等 Optical Modulus, etc. 產(chǎn)品應(yīng)用 APPLICATIONS ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ 175 185 200 42 209 1.8 \/ 4.81*109 2.72*108 135 65 \/ 535 485 0.12 395 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 4.07 SPDR method 10GHz C-24\/23\/50 3.90 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞60 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 13 N\/mm 0.60 0.75 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC50%) 介質(zhì)損耗 Df-Loss Tangent (RC50%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0034 SPDR method 10GHz C-24\/23\/50 0.0055 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

H360 77 Very Low Loss & Heat Resistance Material ◆優(yōu)異的耐熱性 Excellent thermal reliability ◆優(yōu)秀的耐CAF性能 Excellent anti-CAF performance ◆較低的Dk\/Df Lower Dk\/Df ◆更低的Z軸熱膨脹系數(shù)、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability 產(chǎn)品特性 FEATURES 產(chǎn)品性能GENERAL PROPERTIES ◆超高速網(wǎng)絡(luò)設(shè)備 Ultra high speed network equipment ◆服務(wù)器、交換機(jī)、存儲 Server, Switch, Storage ◆高性能計(jì)算機(jī) High performance computing ◆光通信產(chǎn)品 Optical communication products 產(chǎn)品應(yīng)用 APPLICATIONS ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 180 208 40 258 2.5 \/ 2.21*109 1.56*108 125 58 0.55 420 380 0.11 395 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.72 SPDR method 10GHz C-24\/23\/50 3.65 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞60 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 13 N\/mm 0.60 0.75 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC54%) 介質(zhì)損耗 Df-Loss Tangent (RC54%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0023 SPDR method 10GHz C-24\/23\/50 0.0048 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

H360(Z) 78 Very Low Loss & Heat Resistance Material 產(chǎn)品性能GENERAL PROPERTIES ◆優(yōu)異的耐熱性 Excellent thermal reliability ◆優(yōu)秀的耐CAF性能 Excellent anti-CAF performance ◆較低的Dk\/Df Lower Dk\/Df 產(chǎn)品特性 FEATURES ◆服務(wù)器、交換機(jī)、存儲 Server, Switch, Storage ◆高性能計(jì)算機(jī) High performance computing ◆光通信產(chǎn)品 Optical communication products 產(chǎn)品應(yīng)用 APPLICATIONS 9 8 ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 190 215 35 203 2.0 \/ 2.21*109 1.56*108 120 60 0.65 525 485 0.08 408 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.71 SPDR method 10GHz C-24\/23\/50 3.65 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞60 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 10 N\/mm 0.65 0.75 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC56%) 介質(zhì)損耗 Df-Loss Tangent (RC56%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0031 SPDR method 10GHz C-24\/23\/50 0.0045 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

H350 79 Ultra Low Loss & Heat Resistance Material ◆優(yōu)異的耐熱性 Excellent thermal reliability ◆優(yōu)秀的耐CAF性能 Excellent anti-CAF performance ◆較低的Dk\/Df Lower Dk\/Df ◆更低的熱膨脹系數(shù) Lower CTE 產(chǎn)品特性 FEATURES ◆超高速網(wǎng)絡(luò)設(shè)備 Ultra high speed network equipment ◆服務(wù)器、交換機(jī)、存儲 Server, Switch, Storage ◆高性能計(jì)算機(jī) High performance computing ◆光通信產(chǎn)品 Optical communication products 產(chǎn)品應(yīng)用 APPLICATIONS 產(chǎn)品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ 175 185 207 40 180 2.0 \/ 1.0*109 1.0*108 120 62 0.60 500 480 0.08 403 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.90 SPDR method 10GHz C-24\/23\/50 3.70 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 7 N\/mm 0.56 0.65 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC55%) 介質(zhì)損耗 Df-Loss Tangent (RC55%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0037 SPDR method 10GHz C-24\/23\/50 0.0042 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

H350(K) 80 Ultra Low Loss & Heat Resistance Material 產(chǎn)品特性 FEATURES 產(chǎn)品應(yīng)用 APPLICATIONS ◆優(yōu)異的耐熱性 Excellent thermal reliability ◆優(yōu)秀的耐CAF性能 Excellent anti-CAF performance ◆較低的Dk\/Df Lower Dk\/Df ◆更低的熱膨脹系數(shù) Lower CTE ◆超高速網(wǎng)絡(luò)設(shè)備 Ultra high speed network equipment ◆服務(wù)器、交換機(jī)、存儲 Server, Switch, Storage ◆高性能計(jì)算機(jī) High performance computing ◆光通信產(chǎn)品 Optical communication products 產(chǎn)品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ 175 185 207 40 180 2.0 \/ 1.0*109 1.0*108 120 62 0.60 500 480 0.08 403 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.44 SPDR method 10GHz C-24\/23\/50 3.42 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 7 N\/mm 0.56 0.65 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC58%) 介質(zhì)損耗 Df-Loss Tangent (RC58%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0017 SPDR method 10GHz C-24\/23\/50 0.0021 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

HSD7 Ultra Low Loss & Heat Resistance Material 產(chǎn)品特性 FEATURES 產(chǎn)品性能GENERAL PROPERTIES 產(chǎn)品應(yīng)用 APPLICATIONS 81 ◆優(yōu)異的耐熱性 Excellent thermal reliability ◆優(yōu)秀的耐CAF性能 Excellent anti-CAF performance ◆較低的Dk\/Df Lower Dk\/Df ◆更低的Z軸熱膨脹系數(shù)、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability ◆超高速網(wǎng)絡(luò)設(shè)備 Ultra high speed network equipment ◆服務(wù)器、交換機(jī)、存儲 Server, Switch, Storage ◆高性能計(jì)算機(jī) High performance computing ◆光通信產(chǎn)品 Optical communication products ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 195 220 45 230 2.3 \/ 1.0*109 1.0*108 120 62 0.65 420 390 0.08 405 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.54 SPDR method 10GHz C-24\/23\/50 3.53 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 12.3 N\/mm 0.70 0.65 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC59%) 介質(zhì)損耗 Df-Loss Tangent (RC59%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0031 SPDR method 10GHz C-24\/23\/50 0.0035 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

HSD7(K) Ultra Low Loss & Heat Resistance Material 產(chǎn)品特性 FEATURES 產(chǎn)品性能GENERAL PROPERTIES 產(chǎn)品應(yīng)用 APPLICATIONS 82 ◆優(yōu)異的耐熱性 Excellent thermal reliability ◆優(yōu)秀的耐CAF性能 Excellent anti-CAF performance ◆較低的Dk\/Df Lower Dk\/Df ◆更低的Z軸熱膨脹系數(shù)、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability ◆超高速網(wǎng)絡(luò)設(shè)備 Ultra high speed network equipment ◆交換機(jī)、路由器、存儲 Switch, Routers, Storage ◆高性能計(jì)算機(jī)、AI計(jì)算 High performance co- mputing、AI computing ◆光通信產(chǎn)品 Optical communication products ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 195 220 45 230 2.3 \/ 1.0*109 1.0*108 120 62 0.65 420 390 0.08 405 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.32 SPDR method 10GHz C-24\/23\/50 3.30 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 11.9 N\/mm 0.70 0.65 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC61%) 介質(zhì)損耗 Df-Loss Tangent (RC61%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0019 SPDR method 10GHz C-24\/23\/50 0.0023 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

HSD7JA(K) Ultra Low Loss & Heat Resistance Material 產(chǎn)品特性 FEATURES 產(chǎn)品性能GENERAL PROPERTIES 產(chǎn)品應(yīng)用 APPLICATIONS 83 ◆優(yōu)異的耐熱性 Excellent thermal reliability ◆優(yōu)秀的耐CAF性能 Excellent anti-CAF performance ◆較低的Dk\/Df Lower Dk\/Df ◆更低的Z軸熱膨脹系數(shù)、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability ◆超高速網(wǎng)絡(luò)設(shè)備 Ultra high speed network equipment ◆交換機(jī)、路由器、存儲 Switch, Routers, Storage ◆高性能計(jì)算機(jī)、AI計(jì)算 High performance co- mputing、AI computing ◆光通信產(chǎn)品 Optical communication products ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 195 217 45 240 2.5 \/ 1.0*109 1.0*108 120 ＞50 0.71 380 360 0.06 410 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.19 SPDR method 10GHz C-24\/23\/50 3.17 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 12.5 N\/mm 0.60 0.65 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC68%) 介質(zhì)損耗 Df-Loss Tangent (RC68%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0018 SPDR method 10GHz C-24\/23\/50 0.0019 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

HSD7LG Halogen-free Ultra-low Loss & Heat Resistance Material 產(chǎn)品特性 FEATURES 產(chǎn)品性能GENERAL PROPERTIES 產(chǎn)品應(yīng)用 APPLICATIONS 84 ◆較低的Dk\/Df Lower Dk\/Df ◆優(yōu)異的耐熱性 Excellent thermal reliability ◆優(yōu)秀的耐CAF性能 Excellent anti-CAF performance ◆更低的Z軸熱膨脹系數(shù)、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability ◆AI服務(wù)器、交換機(jī)、存儲、路由器 AI Server, switch, storage, routers ◆光通信產(chǎn)品 Optical communication products ◆AI計(jì)算、AI服務(wù)器 AI computing、AI Server ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 200 225 31 200 1.8 \/ 1.0*1010 1.0*108 120 ＞50 0.54 420 380 0.07 410 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.93 SPDR method 10GHz C-24\/23\/50 3.90 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 10.1 N\/mm 0.69 0.75 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC53%) 介質(zhì)損耗 Df-Loss Tangent (RC53%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0037 SPDR method 10GHz C-24\/23\/50 0.0044 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

HSD7LG(K) Halogen-free Ultra-low Loss & Heat Resistance Material 產(chǎn)品特性 FEATURES 產(chǎn)品性能GENERAL PROPERTIES 產(chǎn)品應(yīng)用 APPLICATIONS 85 ◆較低的Dk\/Df Lower Dk\/Df ◆優(yōu)異的耐熱性 Excellent thermal reliability ◆優(yōu)秀的耐CAF性能 Excellent anti-CAF performance ◆更低的Z軸熱膨脹系數(shù)、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability ◆交換機(jī)、存儲、路由器 Switch, storage, routers ◆光通信產(chǎn)品 Optical communication products ◆AI計(jì)算、AI服務(wù)器 AI computing、AI Server ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 200 225 31 200 1.8 \/ 1.0*1010 1.0*108 120 ＞50 0.54 420 380 0.07 410 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.40 SPDR method 10GHz C-24\/23\/50 3.37 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 9.1 N\/mm 0.69 0.75 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC55%) 介質(zhì)損耗 Df-Loss Tangent (RC55%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0021 SPDR method 10GHz C-24\/23\/50 0.0025 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

HSD8(K) 86 ◆更低的損耗 Extreme Low Loss ◆優(yōu)異的耐熱性 Excellent thermal resistance ◆更低的Z軸熱膨脹系數(shù) Low Z axis CTE ◆更低的吸水率、優(yōu)秀的耐CAF性能、優(yōu)異的可靠性 Low water absorption, excellent anti-CAF, high reliability 產(chǎn)品特性 FEATURES ◆交換機(jī)、服務(wù)器 Switch, Server ◆路由器、AI計(jì)算 Router、AI computing ◆測量儀器 Measuring instrument 產(chǎn)品應(yīng)用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 產(chǎn)品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 199 226 38 145 1.5 \/ 4.93*109 3.72*108 135 65 0.55 384 350 0.10 406 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.31 SPDR method 10GHz C-24\/23\/50 3.25 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 9.6 N\/mm 0.55 0.60 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC68%) 介質(zhì)損耗 Df-Loss Tangent (RC68%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0011 SPDR method 10GHz C-24\/23\/50 0.0014 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

HSD8 87 ◆更低的損耗 Extreme Low Loss ◆優(yōu)異的耐熱性 Excellent thermal resistance ◆更低的Z軸熱膨脹系數(shù) Low Z axis CTE ◆更低的吸水率、優(yōu)秀的耐CAF性能、優(yōu)異的可靠性 Low water absorption, excellent anti-CAF, high reliability 產(chǎn)品特性 FEATURES ◆交換機(jī)、服務(wù)器 Switch, Server ◆路由器、AI計(jì)算 Router、AI computing ◆測量儀器 Measuring instrument 產(chǎn)品應(yīng)用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 產(chǎn)品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 199 226 38 145 1.5 \/ 4.93*109 3.72*108 135 65 0.55 384 350 0.10 406 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.19 SPDR method 10GHz C-24\/23\/50 3.12 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 9.5 N\/mm 0.55 0.60 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC69%) 介質(zhì)損耗 Df-Loss Tangent (RC69%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0009 SPDR method 10GHz C-24\/23\/50 0.0012 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

HSD8(C) 88 ◆低介電常數(shù)、介質(zhì)損耗 Low Dk、Df ◆優(yōu)異的耐熱性 Excellent thermal resistance ◆更低的Z軸熱膨脹系數(shù) Low Z axis CTE ◆較低的吸水率、耐CAF性能好、高可靠性 Low water absorption, excellent anti-CAF, high reliability ◆無鉛制程兼容 Compatible with Lead-free process 產(chǎn)品特性 FEATURES ◆交換機(jī)、服務(wù)器 Switch, Server ◆路由器、AI計(jì)算 Router、AI computing ◆測量儀器 Measuring instrument 產(chǎn)品應(yīng)用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 產(chǎn)品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 199 216 38 165 1.5 \/ 4.93*109 3.72*108 135 65 0.55 455 425 0.10 385 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.19 SPDR method 10GHz C-24\/23\/50 3.15 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 9.5 N\/mm 0.55 0.60 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC68%) 介質(zhì)損耗 Df-Loss Tangent (RC68%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0009 SPDR method 10GHz C-24\/23\/50 0.0012 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

HSD8LG K 89 ◆更低的損耗、更低的熱膨脹系數(shù) Extreme Low Loss、Lower CTE ◆優(yōu)異的耐熱性、無鹵素成分 Excellent thermal resistance、Halogen Free ◆更低的吸水率、優(yōu)秀的耐CAF性能、優(yōu)異的可靠性 Low water absorption, excellent anti-CAF, high reliability 產(chǎn)品特性 FEATURES ◆交換機(jī)、服務(wù)器 Switch, Server ◆路由器、AI計(jì)算 Router、AI computing ◆測量儀器 Measuring instrument 產(chǎn)品應(yīng)用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 產(chǎn)品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 198 226 45 145 1.5 \/ 4.95*109 4.72*108 135 65 0.65 355 345 0.10 409 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.31 SPDR method 10GHz C-24\/23\/50 3.25 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 4.8 N\/mm 0.60 0.60 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC64%) 介質(zhì)損耗 Df-Loss Tangent (RC64%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0012 SPDR method 10GHz C-24\/23\/50 0.0015 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

HSD8LG K2 90 ◆更低的損耗 Extreme Low Loss ◆優(yōu)異的耐熱性 Excellent thermal resistance ◆更低的熱膨脹系數(shù) Lower CTE ◆更低的吸水率、優(yōu)秀的耐CAF性能、優(yōu)異的可靠性 Low water absorption, excellent anti-CAF, high reliability ◆無鹵素成分 Halogen Free 產(chǎn)品特性 FEATURES ◆交換機(jī)、服務(wù)器 Switch, Server ◆路由器、AI計(jì)算 Router、AI computing ◆測量儀器 Measuring instrument 產(chǎn)品應(yīng)用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 產(chǎn)品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 200 223 45 140 1.8 \/ 4.95*109 4.72*108 135 65 0.65 360 350 0.10 408 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.19 SPDR method 10GHz C-24\/23\/50 3.15 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 4.6 N\/mm 0.60 0.60 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC66%) 介質(zhì)損耗 Df-Loss Tangent (RC66%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0010 SPDR method 10GHz C-24\/23\/50 0.0013 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

HSD8LG Q 91 ◆更低的損耗、更低的熱膨脹系數(shù) Extreme Low Loss、Lower CTE ◆優(yōu)異的耐熱性、無鹵素成分 Excellent thermal resistance、Halogen Free ◆更低的吸水率、優(yōu)秀的耐CAF性能、優(yōu)異的可靠性 Low water absorption, excellent anti-CAF, high reliability 產(chǎn)品特性 FEATURES ◆交換機(jī)、服務(wù)器 Switch, Server ◆路由器、AI計(jì)算 Router、AI computing ◆測量儀器 Measuring instrument 產(chǎn)品應(yīng)用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 產(chǎn)品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 200 221 40 145 1.5 \/ 4.90*109 4.82*108 135 65 0.65 365 355 0.10 408 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.14 SPDR method 10GHz C-24\/23\/50 3.09 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 3.1 N\/mm 0.60 0.60 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC65%) 介質(zhì)損耗 Df-Loss Tangent (RC65%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0009 SPDR method 10GHz C-24\/23\/50 0.0011 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

HSD9LG Q 92 ◆更低的損耗、更低的熱膨脹系數(shù) Extreme Low Loss、Lower CTE ◆優(yōu)異的耐熱性、無鹵素成分 Excellent thermal resistance、Halogen Free ◆更低的吸水率、優(yōu)秀的耐CAF性能、優(yōu)異的可靠性 Low water absorption, excellent anti-CAF, high reliability 產(chǎn)品特性 FEATURES ◆交換機(jī)、服務(wù)器 Switch, Server ◆路由器、AI計(jì)算 Router、AI computing ◆測量儀器 Measuring instrument 產(chǎn)品應(yīng)用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 產(chǎn)品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 190 221 45 140 1.6 \/ 4.17*109 3.45*108 135 65 0.55 310 315 0.10 400 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.06 SPDR method 10GHz C-24\/23\/50 3.05 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 5.5 N\/mm 0.60 0.60 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC70%) 介質(zhì)損耗 Df-Loss Tangent (RC70%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.00062 SPDR method 10GHz C-24\/23\/50 0.00065 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

HSD9LG K2 93 ◆更低的損耗、更低的熱膨脹系數(shù) Extreme Low Loss、Lower CTE ◆優(yōu)異的耐熱性、無鹵素成分 Excellent thermal resistance、Halogen Free ◆更低的吸水率、優(yōu)秀的耐CAF性能、優(yōu)異的可靠性 Low water absorption, excellent anti-CAF, high reliability 產(chǎn)品特性 FEATURES ◆交換機(jī)、服務(wù)器 Switch, Server ◆路由器、AI計(jì)算 Router、AI computing ◆測量儀器 Measuring instrument 產(chǎn)品應(yīng)用 APPLICATIONS Extreme Low Loss & Heat Resistance Material 產(chǎn)品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 190 221 45 140 1.6 \/ 4.17*109 3.45*108 135 65 0.55 310 315 0.10 400 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.20 SPDR method 10GHz C-24\/23\/50 3.16 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞30 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 6.2 N\/mm 0.60 0.60 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC70%) 介質(zhì)損耗 Df-Loss Tangent (RC70%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0009 SPDR method 10GHz C-24\/23\/50 0.0011 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

HSD6LG 94 Halogen-free Ultra-low Loss & Heat Resistance Material 產(chǎn)品特性 FEATURES 產(chǎn)品應(yīng)用 APPLICATIONS ◆較低的Dk\/Df Lower Dk\/Df ◆優(yōu)異的耐熱性 Excellent thermal reliability ◆優(yōu)秀的耐CAF性能 Excellent anti-CAF performance ◆更低的Z軸熱膨脹系數(shù)、提供卓越的PTH可靠性 Lower Z-axis CTE, offering superior PTH reliability ◆服務(wù)器、交換機(jī)、存儲、路由器 Server, switch, storage, routers ◆汽車毫米波雷達(dá) Millimeter wave radar for Automotive ◆高性能計(jì)算機(jī) High performance computing 產(chǎn)品性能GENERAL PROPERTIES ℃ ℃ ℃ ppm\/℃ ppm\/℃ % MΩ·cm MΩ sec KV N\/mm2 % ℃ \/ 200 225 43 240 2.2 \/ 1*1010 1*108 120 ＞50 0.55 420 380 0.07 410 DSC TMA DMA ＜Tg，TMA ＞Tg，TMA 50~260℃，TMA 1MHz C-24\/23\/50 C-96\/35\/90 D48\/50+D0.5\/23 D48\/50+D0.5\/23 As received E-1\/105+D-24\/23 TGA(5%W.L) 2.4.25 2.4.24 2.4.24.4 2.4.13.1 2.4.24 2.5.5.9 2.5.5.9 1GHz C-24\/23\/50 \/ 3.66 SPDR method 10GHz C-24\/23\/50 3.92 2.5.17.1 2.5.1 2.5.6 2.4.4 2.6.2.1 2.4.24.6 TMA(Clad) min ＞60 2.4.24.1 TMA(Etched) min ＞60 IEC-60112 C-96\/20\/65 Rating PLC 3 288°C, solder dip sec >180 2.4.24.5 ＜Tg，TMA ppm\/℃ 10 N\/mm 0.54 0.55 2.4.8 1 oz As received 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value 耐熱性-T288 熱應(yīng)力-Thermal Stress 熱膨脹系數(shù)-CTE (Z-axis) 介電常數(shù) Dk-Permittivity(RC62%) 介質(zhì)損耗 Df-Loss Tangent (RC62%) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 耐電弧性-Arc Resistance 擊穿電壓-Dielectric Breakdown 相對漏電起痕指數(shù)-CTI 吸水率-Water Absorption 耐燃性-Flammability UL-94 A&E-24\/125 \/ V0 熱分解溫度-TD (Decomposition Temperature) 彎曲強(qiáng)度Flexural Strength Warp Fill 玻璃態(tài)轉(zhuǎn)化溫度-TG 熱膨脹系數(shù)-CTE (XY-axis) 項(xiàng)目 Item 剝離強(qiáng)度(HTE)-Peel Strength 剝離強(qiáng)度(RTF)-Peel Strength 剝離強(qiáng)度(HVLP)-Peel Strength 2.5.5.9 1MHz C-24\/23\/50 \/ 2.5.5.9 1GHz C-24\/23\/50 \/ 0.0033 SPDR method 10GHz C-24\/23\/50 0.0045 熱性能 Thermal 電性能 Electrical 物理性能 Physical 屬性 Property

PTFE with Glass Reinforced RF Circuit Material H5220 95 ◆Dk\/Df在不同頻率和溫度下保持穩(wěn)定 Consistent and Stable Dk\/Df over Frequency and Temperature ◆低損耗因子 Low Dielectric Loss Tangent ◆低吸水率 Low Moisture Absorption ◆卓越的性價比 Excellent Price Performance Value 產(chǎn)品特性 FEATURES 產(chǎn)品性能GENERAL PROPERTIES ◆基站天線 Base Station Antennas ◆衛(wèi)星通訊 Satellite Communications ◆濾波器、耦合器、低噪聲放大器 Filers, Couplers, LNAs ◆功率放大器 Power Amplifiers ◆相控陣天線 Phased Array Antennas ◆航空電子和航空航天 Avionics and Aerospace 產(chǎn)品應(yīng)用 APPLICATIONS 10GHz\/23℃ 10GHz\/23℃ CTE (30-260℃) CTE (30-260℃) CTE (30-260℃) C-96\/35\/90 C-96\/35\/90 100℃ D-24\/23 - C-48\/23\/50 C-48\/23\/50, E-24\/125 介電常數(shù)-Dk 介質(zhì)損耗-Df 熱膨脹系數(shù)-CTE (X) 熱膨脹系數(shù)-CTE (Y) 熱膨脹系數(shù)-CTE (Z) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 導(dǎo)熱系數(shù)-Thermal Conductivity 吸水率-Water Absorption 熱分解溫度-TD 剝離強(qiáng)度-Peel strength (Hoz Cu) 耐燃性-Flammability 2.5.5.5 2.5.5.5 2.4.24C 2.4.24C 2.4.24C 2.5.17.1 2.5.17.1 ASTM-D5470 2.6.2.1A 2.4.24.6 2.4.8 UL94 \/ \/ ppm \/ ℃ ppm \/ ℃ ppm \/ ℃ MΩ·cm MΩ W\/m·K % ℃ N\/mm \/ 2.20+\/-0.04 0.0009 20 20 220 108 108 0.27 <0.1 >500 ≥1.2 V0 產(chǎn)品規(guī)格PRODUCT SPECIFICATIONS 厚度 Standard Thickness 常規(guī)尺寸 Standard Panel Size 標(biāo)配銅箔 Standard Copper Foil 0.020\"(0.508mm) ±0.002\" 0.030\"(0.762mm) ±0.002\" 0.040\"(1.016mm) ±0.002\" 0.060\"(1.524mm) ±0.004\" 41\"*49\" (1041mmx1245mm) 37\"*49\" (940mmx1245mm) 18\"*24\" (457mmx610mm) 1\/2 OZ (17μm) 1 OZ (35μm) 項(xiàng)目 Item 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value

PTFE with Glass Reinforced RF Circuit Material H5255 96 ◆Dk\/Df在不同頻率和溫度下保持穩(wěn)定 Consistent and Stable Dk\/Df over Frequency and Temperature ◆低損耗因子 Low Dielectric Loss Tangent ◆低吸水率 Low Moisture Absorption ◆卓越的性價比 Excellent Price Performance Value 產(chǎn)品特性 FEATURES ◆基站天線 Base Station Antennas ◆衛(wèi)星通訊 Satellite Communications ◆濾波器、耦合器、低噪聲放大器 Filers, Couplers, LNAs ◆功率放大器 Power Amplifiers ◆相控陣天線 Phased Array Antennas ◆航空電子和航空航天 Avionics and Aerospace 產(chǎn)品應(yīng)用 APPLICATIONS 產(chǎn)品性能GENERAL PROPERTIES 10GHz\/23℃ 10GHz\/23℃ CTE (30-260℃) CTE (30-260℃) CTE (30-260℃) C-96\/35\/90 C-96\/35\/90 100℃ D-24\/23 - C-48\/23\/50 C-48\/23\/50 介電常數(shù)-Dk 介質(zhì)損耗-Df 熱膨脹系數(shù)-CTE (X) 熱膨脹系數(shù)-CTE (Y) 熱膨脹系數(shù)-CTE (Z) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 導(dǎo)熱系數(shù)-Thermal Conductivity 吸水率-Water Absorption 熱分解溫度-TD 剝離強(qiáng)度-Peel strength (Hoz Cu) 耐燃性-Flammability 2.5.5.5 2.5.5.5 2.4.24C 2.4.24C 2.4.24C 2.5.17.1 2.5.17.1 ASTM-D5470 2.6.2.1A 2.4.24.6 2.4.8 UL94 \/ \/ ppm \/ ℃ ppm \/ ℃ ppm \/ ℃ MΩ·cm MΩ W\/m·K % ℃ N\/mm \/ 2.55+\/-0.05 0.0018 15 15 200 108 108 0.27 <0.1 >500 ≥1.2 V0 產(chǎn)品規(guī)格PRODUCT SPECIFICATIONS 厚度 Standard Thickness 常規(guī)尺寸 Standard Panel Size 標(biāo)配銅箔 Standard Copper Foil 0.030\"(0.762mm) ±0.002\" 0.040\"(1.016mm) ±0.002\" 0.060\"(1.524mm) ±0.004\" 41\"*49\" (1041mmx1245mm) 37\"*49\" (940mmx1245mm) 18\"*24\" (457mmx610mm) 1\/2 OZ (17μm) 1 OZ (35μm) 項(xiàng)目 Item 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value

PTFE with Glass Reinforced RF Circuit Material H5265 97 產(chǎn)品性能GENERAL PROPERTIES 10GHz\/23℃ 10GHz\/23℃ CTE (30-260℃) CTE (30-260℃) CTE (30-260℃) C-96\/35\/90 C-96\/35\/90 100℃ D-24\/23 - C-48\/23\/50 C-48\/23\/50 介電常數(shù)-Dk 介質(zhì)損耗-Df 熱膨脹系數(shù)-CTE (X) 熱膨脹系數(shù)-CTE (Y) 熱膨脹系數(shù)-CTE (Z) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 導(dǎo)熱系數(shù)-Thermal Conductivity 吸水率-Water Absorption 熱分解溫度-TD 剝離強(qiáng)度-Peel strength (Hoz Cu) 耐燃性-Flammability 2.5.5.5 2.5.5.5 2.4.24C 2.4.24C 2.4.24C 2.5.17.1 2.5.17.1 ASTM-D5470 2.6.2.1A 2.4.24.6 2.4.8 UL94 \/ \/ ppm \/ ℃ ppm \/ ℃ ppm \/ ℃ MΩ·cm MΩ W\/m·K % ℃ N\/mm \/ 2.65+\/-0.05 0.0018 16 16 160 108 108 0.30 <0.1 >500 ≥1.2 V0 產(chǎn)品規(guī)格PRODUCT SPECIFICATIONS 厚度 Standard Thickness 常規(guī)尺寸 Standard Panel Size 標(biāo)配銅箔 Standard Copper Foil 0.030\"(0.762mm) ±0.002\" 0.040\"(1.016mm) ±0.002\" 0.060\"(1.524mm) ±0.004\" 41\"*49\" (1041mmx1245mm) 37\"*49\" (940mmx1245mm) 18\"*24\" (457mmx610mm) 1\/2 OZ (17μm) 1 OZ (35μm) 項(xiàng)目 Item 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value ◆Dk\/Df在不同頻率和溫度下保持穩(wěn)定 Consistent and Stable Dk\/Df over Frequency and Temperature ◆低損耗因子 Low Dielectric Loss Tangent ◆低吸水率 Low Moisture Absorption ◆卓越的性價比 Excellent Price Performance Value 產(chǎn)品特性 FEATURES ◆基站天線 Base Station Antennas ◆衛(wèi)星通訊 Satellite Communications ◆濾波器、耦合器、低噪聲放大器 Filers, Couplers, LNAs ◆功率放大器 Power Amplifiers ◆相控陣天線 Phased Array Antennas ◆航空電子和航空航天 Avionics and Aerospace 產(chǎn)品應(yīng)用 APPLICATIONS

PTFE with Glass Reinforced RF Circuit Material H5300H 98 產(chǎn)品性能GENERAL PROPERTIES 10GHz\/23℃ 10GHz\/23℃ CTE (30-260℃) CTE (30-260℃) CTE (30-260℃) C-96\/35\/90 C-96\/35\/90 100℃ D-24\/23 - C-48\/23\/50 C-48\/23\/50 介電常數(shù)-Dk 介質(zhì)損耗-Df 熱膨脹系數(shù)-CTE (X) 熱膨脹系數(shù)-CTE (Y) 熱膨脹系數(shù)-CTE (Z) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 導(dǎo)熱系數(shù)-Thermal Conductivity 吸水率-Water Absorption 熱分解溫度-TD 剝離強(qiáng)度-Peel strength (Hoz Cu) 耐燃性-Flammability 2.5.5.5 2.5.5.5 2.4.24C 2.4.24C 2.4.24C 2.5.17.1 2.5.17.1 ASTM-D5470 2.6.2.1A 2.4.24.6 2.4.8 UL94 \/ \/ ppm \/ ℃ ppm \/ ℃ ppm \/ ℃ MΩ·cm MΩ W\/m·K % ℃ N\/mm \/ 2.98+\/-0.05 0.0020 14 14 80 108 108 0.30 <0.15 >500 ≥1.20 V0 產(chǎn)品規(guī)格PRODUCT SPECIFICATIONS 厚度 Standard Thickness 常規(guī)尺寸 Standard Panel Size 標(biāo)配銅箔 Standard Copper Foil 0.020\"(0.508mm) ±0.002\" 0.030\"(0.762mm) ±0.002\" 0.040\"(1.016mm) ±0.002\" 0.060\"(1.524mm) ±0.004\" 41\"*49\" (1041mmx1245mm) 37\"*49\" (940mmx1245mm) 18\"*24\" (457mmx610mm) 1\/2 OZ (17μm) 1 OZ (35μm) 項(xiàng)目 Item 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value ◆Dk\/Df在不同頻率和溫度下保持穩(wěn)定 Consistent and Stable Dk\/Df over Frequency and Temperature ◆低損耗因子 Low Dielectric Loss Tangent ◆低吸水率 Low Moisture Absorption ◆卓越的性價比 Excellent Price Performance Value 產(chǎn)品特性 FEATURES ◆基站天線 Base Station Antennas ◆衛(wèi)星通訊 Satellite Communications ◆天線饋電網(wǎng)絡(luò) Antenna Feed Networks ◆DAS & CPE 天線 DAS & CPE Antenna ◆射頻無源元件 RF Passive Components 產(chǎn)品應(yīng)用 APPLICATIONS

PTFE with Glass Reinforced RF Circuit Material H5300S 99 ◆Dk\/Df在不同頻率和溫度下保持穩(wěn)定 Consistent and Stable Dk\/Df over Frequency and Temperature ◆低損耗因子 Low Dielectric Loss Tangent ◆低吸水率 Low Moisture Absorption ◆卓越的性價比 Excellent Price Performance Value 產(chǎn)品特性 FEATURES ◆基站天線 Base Station Antennas ◆衛(wèi)星通訊 Satellite Communications ◆天線饋電網(wǎng)絡(luò) Antenna Feed Networks ◆DAS & CPE 天線 DAS & CPE Antenna ◆射頻無源元件 RF Passive Components 產(chǎn)品應(yīng)用 APPLICATIONS 產(chǎn)品性能GENERAL PROPERTIES 產(chǎn)品規(guī)格PRODUCT SPECIFICATIONS 厚度 Standard Thickness 常規(guī)尺寸 Standard Panel Size 標(biāo)配銅箔 Standard Copper Foil 0.0051\"(0.130mm)±0.0007\" 0.0094\"(0.239mm)±0.0007\" 0.020\"(0.508mm) ±0.001\" 0.030\"(0.762mm) ±0.001\" 0.040\"(1.016mm) ±0.002\" 0.050\"(1.270mm) ±0.003\" 0.060\"(1.524mm) ±0.004\" 2.79 2.89 2.92 2.94 2.94 2.97 2.98 36\"*48\" (914mm×1219mm) 18\"*24\" (457mm×610mm) 1\/2 OZ (17μm) 1 OZ (35μm) 可選埋阻銅箔 介電常數(shù) DK 10GHz\/23℃ 10GHz\/23℃ 10GHz (-40-150℃) CTE (30-260℃) CTE (30-260℃) CTE (30-260℃) C-96\/35\/90 C-96\/35\/90 100℃ D-24\/23 - C-48\/23\/50 C-48\/23\/50 介電常數(shù)-Dk 介質(zhì)損耗-Df 溫漂-TCDK 熱膨脹系數(shù)-CTE (X) 熱膨脹系數(shù)-CTE (Y) 熱膨脹系數(shù)-CTE (Z) 體積電阻-Volume Resistivity 表面電阻-Surface Resistivity 導(dǎo)熱系數(shù)-Thermal Conductivity 吸水率-Water Absorption 熱分解溫度-TD 剝離強(qiáng)度-Peel strength (Hoz Cu) 耐燃性-Flammability 2.5.5.5 2.5.5.5 2.5.5.5 2.4.24C 2.4.24C 2.4.24C 2.5.17.1 2.5.17.1 ASTM-D5470 2.6.2.1A 2.4.24.6 2.4.8 UL94 \/ \/ ppm \/ ℃ ppm \/ ℃ ppm \/ ℃ ppm \/ ℃ MΩ·cm MΩ W\/m·K % ℃ N\/mm \/ 2.94+\/-0.05 0.0012 -9 8 8 20 108 108 0.55 <0.2 >500 ≥0.80 V0 項(xiàng)目 Item 檢測方法 IPC-TM-650 測試條件 Test Condition 單位 Unit 典型值 Typical value

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